3D Technology Overview: Going into 3rd Dimension

This overview examines Moore’s Law and considers various viewpoints on its continued relevance. The industry is increasingly shifting focus from transistor density to system-level innovations and advancing towards 3D integration. The discussion covers the evolution of transistor architecture and modern interconnects, and highlights the reticle limit as a fundamental challenge in chip manufacturing. Key advantages of 3D ICs are presented, including enhanced density, performance, heterogeneous integration, reduced power consumption, improved bandwidth, and a smaller footprint. Challenges such as manufacturing complexity, thermal management, and cost are also addressed.

Larisa Goffman-Vinopal holds an M.Sc. in EE from Technion, Haifa, Israel, and has 30 years of experience in high-speed CPU development. Her expertise spans memory design, performance validation, power/performance projection, and various aspects of circuit design and debug. She has held key engineering and leadership roles at Google , Amazon and Intel, focusing on circuit design methodology and CPU development across multiple technology nodes.

The lecture is conducted as a part of the course “VLSI Physical Design Automation 046918”.